Thermal Dispensing FIP
Technical Specifications

Due to its softness, this paste is a real alternative to the softest TIM thermal interfaces. It fills the surface roughness between your electronic power component and your heat sink without mechanical stress.

The DG-FIP is available in a 300 CC cartridge or in specific packaging.

ReferenceThermal Conductivity (W/mK) | Hot DiskThermal Conductivity (W/mK) | ASTMD5470Density (g/cc)Compression @3mm, 60PSI (%)

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Free download of the technical datasheet

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