Thermal Dispensing FIP
Due to its softness, this paste is a real alternative to the softest TIM thermal interfaces. It fills the surface roughness between your electronic power component and your heat sink without mechanical stress.
The DG-FIP is available in a 300 CC cartridge or in specific packaging.
|Reference||Thermal Conductivity (W/mK) | Hot Disk||Thermal Conductivity (W/mK) | ASTMD5470||Density (g/cc)||Compression @3mm, 60PSI (%)|
Free download of the technical datasheet
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